| 基片变形法测量薄膜应力分析 |
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| 引用本文： | 方小坤,刘丹.基片变形法测量薄膜应力分析[J].扬州教育学院学报,2009,27(3):12-14. |
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| 作者姓名： | 方小坤 刘丹 |
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| 作者单位： | 扬州职业大学,江苏,扬州,225009 |
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| 摘 要： | 总结了薄膜应力的一些测量方法。分析了利用测量基片弯曲曲率变形分析法的理论依据及其测量原理，计算了激光干涉法，激光束偏转法的测量精度，分析了其优缺点。
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| 关 键 词： | 激光 薄膜 应力 曲率 测量 |
Analysis of the Measurement of Thin Film Stress based on Substrate Deformation |
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| FANG Xiao-kun,LIU Dan.Analysis of the Measurement of Thin Film Stress based on Substrate Deformation[J].Journal of Yangzhou College of Education,2009,27(3):12-14. |
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| Authors: | FANG Xiao-kun LIU Dan |
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| Institution: | (Yangzhou Polytechnic College, Yangzhou 225009, China) |
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| Abstract: | To begin with, some methods of measuring this film stress are summarized in this paper. Then, theoretical basis for using substrate curvature measurement and its measuring principle of laser macro deformation analysis （ including laser interference measurement and laser beam deflection measurement） is analyzed. The precision of different measurements is calculated. Meanwhile, the advantages and the deficiencies of laser macroscopic deformation analysis are outlined. |
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| Keywords: | laser thin film stress curvature measurement |
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