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基于截面显微法的光学材料亚表面损伤检测
引用本文:汉语,刘成有,张勇,崔舒,徐井华.基于截面显微法的光学材料亚表面损伤检测[J].通化师范学院学报,2013(4):19-20.
作者姓名:汉语  刘成有  张勇  崔舒  徐井华
作者单位:通化师范学院物理学院,吉林通化134002
基金项目:吉林省教育厅“十二五”科学技术研究项目(2013.386)
摘    要:针对光学材料亚表面损伤的截面显微法检测进行了深入研究.介绍了截面显微法的基本原理以及样品制备和检测工艺流程,并对检测结果进行了分析,得出了亚表面裂纹深度与磨料粒度之间的比例关系.

关 键 词:光学材料  研磨  亚表面损伤  截面显微法

Subsurface Damage Detection of Optical Materials Based on Transversal Surface Microscopy
HAN Yu,LIU Cheng-you,ZHANG Yong,CUI Shu,XU Jing-hua.Subsurface Damage Detection of Optical Materials Based on Transversal Surface Microscopy[J].Journal of Tonghua Teachers College,2013(4):19-20.
Authors:HAN Yu  LIU Cheng-you  ZHANG Yong  CUI Shu  XU Jing-hua
Institution:(College of Physics,Tonghua Normal University,Tonghua,Jilin 134002,China)
Abstract:A transversal surface microscopy method was presented in this paper to measure the subsurface damage of optical materials.The basic principle of this method was given and the testing result was analyzed.A proportional relationship between sub-surface crack depth and particle size of SIC abrasive was established.
Keywords:optical material  grinding  subsurface damage  Transversal Surface Microscopy
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