| 表面贴装翼形引脚焊点3D外形预测 |
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| 引用本文： | 郑冠群.表面贴装翼形引脚焊点3D外形预测[J].深圳职业技术学院学报,2014(1):24-28. |
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| 作者姓名： | 郑冠群 |
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| 作者单位： | 深圳职业技术学院电子与信息工程学院,广东深圳518055 |
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| 摘 要： | 表面组装技术（Surface Mount Technology，SMT）中，焊点是组装电路板的可靠性影响因素之一，而焊点的形态决定了其可靠性．文章应用Surface Evolver软件，采用有限元方法，以能量最小原理为理论依据，对表贴翼形引脚及焊点进行了三维模型的预测．选取无铅焊料作为焊点材料，通过建立初始模型，施加边界约束、体积约束、重力势能约束和表面势能约束，完成翼形引脚焊点三维形态预测．
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| 关 键 词： | SMT 翼形引脚 形态预测 |
3D Shape Prediction of Solder Joint in Surface Mount Gull Wing Lead |
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| ZHENG Guanqun.3D Shape Prediction of Solder Joint in Surface Mount Gull Wing Lead[J].Journal of Shenzhen Polytechnic,2014(1):24-28. |
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| Authors: | ZHENG Guanqun |
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| Institution: | ZHENG Guanqun (School of EIectronic and Communication Engineering, Shenzhen Polytechnic, Shenzhen, Guangdong 518055, China ) |
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| Abstract: | In the field of surface mount technology （SMT）, the solder joint is one of the factors affecting the reliability of circuit board assembly. The solder joint shape determines the reliability of solder joints. In this paper, by adopting finite element method, surface evolver software and energy minimization principle, 3D shape prediction of solder joint in gull wing lead is predicted. Through the establishment of initial finite element model and application of boundary constraints, size constraints, gravitational potential energy and potential energy surface bound, 3D shape prediction of surface mount gull-wing lead is made in which lead-flee solder materials was chosen. |
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| Keywords: | SMT （surface mount technology） gull wing lead shape prediction |
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