溅射铜基材上浸镀银的微结构表征 On the microstructure of immersion silver on sputtered copper期刊界 All Journals 搜尽天下杂志传播学术成果专业期刊搜索期刊信息化学术搜索

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溅射铜基材上浸镀银的微结构表征

引用本文：	唐电,魏喆良,YOU Shao-xing,邵艳群.溅射铜基材上浸镀银的微结构表征[J].福建工程学院学报,2005,3(3):205-208.

作者姓名：	唐电魏喆良 YOU Shao-xing 邵艳群

作者单位：	1. 福州大学材料研究所,福建,福州,350002;Materials Research Center,University of Missouri-Rolla,Rolla,MO 65409,U.S.A. 2. 福州大学材料研究所,福建,福州,350002 3. Materials Research Center,University of Missouri-Rolla,Rolla,MO 65409,U.S.A.

摘要：	在铜基材上采用电化学浸镀技术沉积银已成为当今一项热门技术。研究采用了含有添加剂的乙醇溶液作为镀液。沉积的银采用场发射扫描电子显微术(FESEM)和原子力显微术(AFM)加以表征。研究表明，采用乙醇基镀槽制备的浸银层具有很强的表面轮廓覆盖能力，在铜基材的凸台区覆盖的银粒子尺寸为15nm左右，而在低凹区的银粒子的尺寸为10m左右。
关键词：	银浸镀铜纳米颗粒
On the microstructure of immersion silver on sputtered copper

TANG Dian,WEI Zhe-liang,YOU Shao-xing,SHAO Yan-qun.On the microstructure of immersion silver on sputtered copper[J].Journal of Fujian University of Technology,2005,3(3):205-208.

Authors:	TANG Dian WEI Zhe-liang YOU Shao-xing SHAO Yan-qun

Abstract:	Electrochemical deposition of silver onto copper substrates by immersion method has been one of the keenly interested topics. In this study, ethanol was used as the plating solution in which some chemicals were added. The silver deposits were characterized by a field emission scanning electron microscopy (FESEM) and an atom force microscope (AFM). It was found that silver immersion using ethanol-based bath had a good coverage feature. The upper strata of the copper substrate were coated by silver particles whose size was around 15 nm. At lower strata, the size of the silver particles was about 10 nm.

Keywords:	silver immersion copper nanoparticles
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